A thermal actuated switchable dry adhesive with high reversibility for transfer printing

Abstract Transfer printing based on switchable adhesive that heterogeneously integrates materials is essential to develop novel electronic systems, such as flexible electronics and micro LED displays. Here, we report a robust design of thermal actuated dry adhesive, which features stiff sphere embedded in thermally responsive shape memory polymer (SMP) substrate encapsulated by an elastomeric membrane. This construct bypasses the unfavorable micro- nano-fabrication processes yields adhesion switchability over 1000 combining peel-rate dependent effect membrane actuation sub-surface sphere. Experimental numerical studies reveal underlying mechanism provide insights into operation adhesive. Demonstrations this concept stamps for transfer fragile objects, silicon wafers, chips, inorganic micro-LED onto challenging non-adhesive surfaces illustrate its potential heterogeneous material integration applications, manufacturing deterministic assembly.